The Memory Pyramid Is Breaking—Here's What Replaces It

Accelerating AI Infrastructure: Marvell at AI Infra Summit

Why AI Infrastructure Is Hitting a Wall (and How Marvell Is Rebuilding It)

Marvell CEO Matt Murphy on the Next Wave of AI Infrastructure

Matt Murphy on CNBC’s Mad Money with Jim Cramer September 8, 2026

Introducing Teralynx T100: Data Center Switch Purpose-built for AI

Inside Co-packaged Optics: The Next Leap in AI Scaling

Globally Connected Optical Infrastructure for AI

The Copper Wall and the Rise of Optics

NVIDIA's Jensen Huang Joins Matt Murphy to Discuss AI Infrastructure

Connectivity Is the Next Big AI Bottleneck

How Marvell Transformed into a Data Center Leader

Powering AI with 224G LR SerDes and Co-packaged Copper

Why AI Performance Is a Connectivity Challenge

Marvell at COMPUTEX 2026

Marvell CEO Matt Murphy Keynote at COMPUTEX 2026

Reducing Data Center TCO with Scalable Memory Pooling

Enabling Next-generation Memory Architecture with CXL

Decoding AI Transformers: The Restaurant Analogy

Shaping Data Center Design with Complementary Solutions

Evolving the Marvell Portfolio and Strategy

Optical Connectivity: The Connecting Thread

What's Next for Marvell in Networking?

How Optical Circuit Switching (OCS) Enables Large-scale GPU Clusters

How Compute CapEx Trends Drive Exponential Connectivity Growth

AI Fabrics Proven: Marvell Infrastructure + Keysight Testing

PCIe-based Scale-up Switching

Extending In‑rack Copper for AI: A Hybrid 200G ACC/AEC Solution

Powering AI Fabrics: 1.6T Optical Interconnects + Open CPX MSA

Inside the 1.6T DR8 PIC: Rack‑to‑Rack Silicon Photonics for AI Clusters

Marvell Ara T™: 1.6T PAM4 DSP Optimized for AI Optical Interconnects

The Hybrid Active Electrical and Copper Cable (AEC + ACC)

Scaling AI Data Centers with 1.6T and 800G Coherent Pluggable Optics

Photonic Fabric™: Optical Scale‑up for Next‑generation AI Clusters

How Advanced Packaging and Die‑to‑Die Interconnects Are Powering Next‑gen AI XPUs

Keeping AI Clusters Fast and Reliable with Real‑time Interconnect Telemetry

800G Campus DCI with the World’s First O‑band Coherent‑lite DSP

NVIDIA and Marvell Collaborate to Expand the AI Ecosystem | Full CNBC Interview with CEOs

Marvell at OFC 2026

Test Drive: Dell, Marvell and Cisco Ace the SAN Stress Test

Reliable Link Analytics and Intelligence for AI Networks: RELIANT Interconnect Telemetry Platform

AECs in Action: Golden Cable Initiative Demonstration

PCIe 8.0 SerDes Demo: Enabling Next-gen, High-bandwidth, Low-latency Connections

Why ACCs Are Built for AI Scale-up and In-rack Connectivity

Alaska P PCIe Retimers Engineered for the Scale-up Domain

Marvell at DesignCon 2026

PCIe 7.0 and 8.0 Breakthrough: The Move Toward Optical Retimers

Foundations for AEC Growth: RELIANT and Golden Cable Explained

Voltage Control for Semis Reimagined with PIVR

The Next Big Custom Market: XPU Attach

Why Optical Is the Fabric of the Future

Golden Cable Initiative: Accelerating the AEC Ecosystem

New Semiconductors for a New Era

The Pluggable Revolution in Scale Across Networks

Introducing Teralynx 102T: Industry’s Only Monolithic Die

Marvell Refreshes Portfolio to Enable AI Networks

Accelerated Infrastructure for Connectivity and Custom Compute

Customizing System Architectures

Building the Infrastructure for the AI Wave of Innovation

Co-packaged Optics Is Almost Here; How Will CPO Integrate?