We are dedicated to the development of cooling technology for high-power, high-heat-flux density chips, especially in liquid cooling and phase-change cooling technology.

What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.

What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat-flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.