System Verilog forDesign

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Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC

Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama

Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications

Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni

Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf

Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs

Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU

3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU

Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross

Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay

Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB

3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST

Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi

3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech

2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University

Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor

3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch

3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm

Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel

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