Zoe's PCBA Tech Talks
ENIG vs ENEPIG | PCB Surface Treatment Process Selection Guide In high-end PCB manufacturing, the surface treatment process directly affects product reliability and cost. STHL explains the differences between the two mainstream processes for you: ENIG (chemical nickel gold) • Cost-effective choice: 30% lower cost than ENEPIG • Basic performance: nickel layer 3-5μm, gold layer 0.05-0.1μm • Applicable scenarios: consumer electronics/ordinary industrial boards ENEPIG (chemical nickel palladium gold) • Flagship process: palladium layer (0.1-0.2μm) prevents nickel corrosion • Super compatibility: suitable for gold wire/aluminum wire bonding • Typical applications: automotive electronics/aerospace-grade products STHL selection suggestions → Multiple reflows required: ENEPIG is more reliable → Cost-sensitive projects: ENIG is competent enough #PCBAManufacturer #surfacetreatment #ENIG #ENEPIG #STHL
3 months ago | [YT] | 1
Zoe's PCBA Tech Talks
ENIG vs ENEPIG | PCB Surface Treatment Process Selection Guide
In high-end PCB manufacturing, the surface treatment process directly affects product reliability and cost. STHL explains the differences between the two mainstream processes for you:
ENIG (chemical nickel gold)
• Cost-effective choice: 30% lower cost than ENEPIG
• Basic performance: nickel layer 3-5μm, gold layer 0.05-0.1μm
• Applicable scenarios: consumer electronics/ordinary industrial boards
ENEPIG (chemical nickel palladium gold)
• Flagship process: palladium layer (0.1-0.2μm) prevents nickel corrosion
• Super compatibility: suitable for gold wire/aluminum wire bonding
• Typical applications: automotive electronics/aerospace-grade products
STHL selection suggestions
→ Multiple reflows required: ENEPIG is more reliable
→ Cost-sensitive projects: ENIG is competent enough
#PCBAManufacturer #surfacetreatment #ENIG #ENEPIG #STHL
3 months ago | [YT] | 1