Zoe Wang
In flexible printed circuit (FPC) manufacturing, polyimide (PI) and SH260 are two dominant substrate materials. As an ISO 9001/IATF 16949/ISO 13485 certified manufacturer, STHL breaks down their key differences: 1. Thermal Resistance • PI: Long-term: 260°C | Short-term: 300°C (ideal for high-temp reflow) • SH260: Long-term: 220°C | Short-term: 250°C (more cost-effective) 2. Mechanical Properties → PI: Bend cycles >1 million (best for dynamic applications) → SH260: Higher rigidity (suited for static installations) 3. Application Recommendations ✓ Automotive/Aerospace: PI (high-temp & vibration resistance) ✓ Consumer Electronics/Medical: SH260 (balanced cost-performance) #FPCmaterials #FlexCircuitManufacturing #MaterialSelection #STHL
3 weeks ago | [YT] | 1
Zoe Wang
In flexible printed circuit (FPC) manufacturing, polyimide (PI) and SH260 are two dominant substrate materials. As an ISO 9001/IATF 16949/ISO 13485 certified manufacturer, STHL breaks down their key differences:
1. Thermal Resistance
• PI:
Long-term: 260°C | Short-term: 300°C (ideal for high-temp reflow)
• SH260:
Long-term: 220°C | Short-term: 250°C (more cost-effective)
2. Mechanical Properties
→ PI:
Bend cycles >1 million (best for dynamic applications)
→ SH260:
Higher rigidity (suited for static installations)
3. Application Recommendations
✓ Automotive/Aerospace: PI (high-temp & vibration resistance)
✓ Consumer Electronics/Medical: SH260 (balanced cost-performance)
#FPCmaterials #FlexCircuitManufacturing #MaterialSelection #STHL
3 weeks ago | [YT] | 1