Automotive chips supplier onsemi has in-depth cooperation with Japan's DENSO in the field of automotive electronics. #Automotiveelectronics#chipssupplier#onsemi#DENSO#icgoodfind#adas On December 17th, onsemi (with the NASDAQ stock symbol: ON), an American automotive chip supplier, and DENSO CORPORATION (hereinafter referred to as "Denso"), an automotive electronics supplier (tier-one), announced the strengthening of their long-term cooperative relationship in the technologies of autonomous driving (AD) and advanced driver assistance systems (ADAS).
For more than ten years, onsemi has been providing Denso with the latest intelligent automotive sensors to enhance the performance of ADAS and autonomous driving. These semiconductors are becoming increasingly important in improving vehicle intelligence, including connectivity, and will contribute to reducing traffic casualties.
"Denso hopes to cooperate more closely with us, which shows their confidence in onsemi's innovation ability, professional knowledge in the automotive technology field accumulated over decades, and supply resilience," said Hassane El-Khoury, President and CEO of onsemi.
"As the world's second-largest automotive system and parts supplier, Denso relies on a powerful supply chain to ensure the reliable supply of key raw materials such as semiconductors, so as to continuously serve customers with cutting-edge and reliable products," said Shinnosuke Hayashi, President of Denso. "Therefore, it is crucial to cooperate closely with industry leaders like onsemi. Over the years, onsemi has been using intelligent sensing technology to improve vehicle safety and autonomy and provides the supply guarantee we expect."
As a symbol of the cooperation between the two parties, Denso plans to acquire shares of onsemi in the open market to further consolidate the long-term cooperative relationship.
About Denso
Denso is headquartered in Kariya City, Japan. It is a leading automotive supplier worth $47.2 billion, developing advanced technologies and components applicable to almost all current vehicle models. With manufacturing as the core, Denso has invested in approximately 180 production facilities around the world, providing promising career opportunities and producing cutting-edge electrification, powertrain, thermal management, and automotive electronics products that are changing the world. During the fiscal year ended March 31, 2024, Denso's R&D expenses accounted for approximately 7.7% of its global consolidated sales.
About onsemi
onsemi (with the NASDAQ stock symbol: ON) is committed to driving disruptive innovation and creating a better future. The company focuses on the major trends in the automotive and industrial end markets, accelerating the transformative innovation in segments such as the electronization of automotive functions, automotive safety, sustainable power grids, industrial automation, and 5G and cloud infrastructure. onsemi provides a highly differentiated portfolio of innovative products as well as intelligent power and intelligent sensing technologies to solve the world's most complex challenges and lead the creation of a safer, cleaner, and smarter world. onsemi is listed among the Fortune 500 in the United States and is also included in the NASDAQ 100 Index and the S&P 500 Index.
STMicroelectronics announced that the 40nm MCU will be produced by Huahong Group, the second-largest wafer foundry in China. #STMicroelectronics#mcu#chips#STM32#ST#SiC#AutomotiveElectronics#icgoodfind On November 21st, news came that STMicroelectronics, a major European chipmaker, held an Investor Day event in Paris, France on Wednesday local time. It announced that it would cooperate with the second-largest wafer foundry in China to produce 40nm-node microcontrollers (MCU) in China to support the achievement of its medium- and long-term revenue goals.
STMicroelectronics, through the implementation of a manufacturing restructuring plan and a cost base adjustment plan, is expected to save up to several million dollars compared to the current cost by 2027. The expected revenue for 2027 - 2028 is about 180 billion US dollars, and the operating profit margin is between 22% and 24%.
To support the achievement of this goal, Jean-Marc Chery, the CEO of STMicroelectronics, announced on Wednesday local time that he would cooperate with Huahong Group, the second-largest wafer foundry in China, and planned to produce 40nm MCU in China by the end of 2025. He believed that local manufacturing in China was crucial for its competitive position.
Fabio Gualandris, the manufacturing director of STMicroelectronics, said that other reasons for manufacturing in China included the cost-effectiveness of the local supply chain, compatibility issues, and the risk of government restrictions. In addition, producing chips anywhere else meant missing out on the rapid electric vehicle development cycle in China.
"They are moving faster," he said. "If you are not here, you cannot respond in a timely manner."
When Jean-Marc Chery made the above remarks, major countries and regions around the world such as the United States, Europe, China, and Japan were all actively promoting more chip manufacturing locally, and many chip companies had been expanding in Singapore and Malaysia to serve the Asian market.
However, STMicroelectronics is the largest manufacturer of energy-saving silicon carbide (SiC) chips for electric vehicles, and its customers include Tesla and Geely. The company said that the Chinese market, as the largest and most innovative market for electric vehicles, was an indispensable market and it was impossible to fully compete from the outside.
Jean-Marc Chery said, "If we cede the market share in China to another company working in the industrial or the automotive field, that is, a Chinese enterprise, they will dominate their own market. And their domestic market is so huge that it will be an excellent platform for them to compete in other countries."
According to STMicroelectronics' plan, the plan to manufacture its STM32 series products in China will help STMicroelectronics expand its customer base by 50% in the next five years.
He added that STMicroelectronics was adopting the best practices and technologies learned in the Chinese market and applying them to the Western market. "The story of the missionary is over," he said.
Before Jean-Marc Chery made the above remarks to reporters in Paris, the company had been hit hard by the downturn in the industrial chip market.
ICGOODFIND recommends a complete list of commonly used chips of STMicroelectronics. STM32F302C8T6 LQFP-48_7x7x05P
STM32F302CBT6 LQFP-48_7x7x05P
STM32F302CBT6TR LQFP-48(7x7)
STM32F302CCT6 48-LQFP
STM32F302CCT7 LQFP-48(7x7)
STM32F302K6U6 32-UFQFN 裸露焊盘
STM32F302K8U6 UFQFPN-32
STM32F302K8U6TR UFQFN-32(5x5)
STM32F302R6T6 LQFP-64(10x10)
STM32F302R8T6 LQFP-64
STM32F302RBT6 LQFP-64
STM32F302RBT6TR LQFP-64(10x10)
STM32F302RBT7 LQFP-64(10x10)
STM32F302RBT7TR LQFP-64(10x10)
STM32F302RCT6 LQFP-64
STM32F302RCT6TR
STM32F302RCT7TR
STM32F302RDT6 LQFP-64(10x10)
STM32F302RDT6TR
STM32F302RET6 LQFP-64(10x10)
STM32F302RET6TR LQFP-64(10x10)
STM32F302VBT6 LQFP-100(14x14)
STM32F302VCT6 LQFP-100(14x14)
STM32F302VCT7 LQFP-100(14x14)
STM32F302VDH6 UFBGA-100(7x7)
STM32F302VDT6 100-LQFP
STM32F302VET6 LQFP-100(14x14)
STM32F302ZET6 LQFP-144(20x20)
STM32F303C6T6 LQFP-48(7x7)
STM32F303C8T6 LQFP-48_7x7x05P
STM32F303CBT6 LQFP-48_7x7x05P
STM32F303CBT6TR LQFP-48(7x7)
STM32F303CBT7 LQFP-48(7x7)
STM32F303CCT6 LQFP-48_7x7x05P
STM32F303CCT6TR LQFP-48(7x7)
STM32F303CCT7 48-LQFP
STM32F303K6T6 LQFP-32(7x7)
STM32F303K8T6 LQFP-32_7x7x08P
STM32F303R6T6 LQFP-64(10x10)
STM32F303R8T6 LQFP-64_10x10x05P
STM32F303RBT6 LQFP-64_10x10x05P
STM32F303RBT6TR LQFP-64(10x10)
STM32F303RBT7 64-LQFP
STM32F303RBT7TR LQFP-64(10x10)
STM32F303RCT6 LQFP-64_10x10x05P
STM32F303RCT6TR LQFP-64
STM32F303RCT7 LQFP-64
STM32F303RDT6 LQFP-64(10x10)
STM32F303RDT7 QFP64
STM32F303RET6 LQFP-64_10x10x05P
STM32F303RET6TR LQFP-64(10x10)
STM32F303RET7 LQFP-64
STM32F303VBT6 LQFP-100(14x14)
STM32F303VBT6TR LQFP-100(14x14)
STM32F303VCT6 LQFP-100_14x14x05P
STM32F303VCT6TR LQFP-100(14x14)
STM32F303VCT7 LQFP-100_14x14x05P
STM32F303VDT6 LQFP-100(14x14)
STM32F303VEH6 UFBGA-100(7x7)
STM32F303VET6 LQFP-100
STM32F303VET6TR LQFP-100(14x14)
STM32F303VET7 LQFP-100(14x14)
STM32F303ZDT6 LQFP-144(20x20)
STM32F303ZET6 LQFP-144_20x20x05P
STM32F303ZET7 LQFP-144(20x20)
STM32F334C6T6 LQFP-48
STM32F334C6T6TR
STM32F334C8T6 LQFP-48_7x7x05P
STM32F334C8T7 LQFP-48(7x7)
STM32F334C8T7TR LQFP-48(7x7)
STM32F334K4T6 LQFP-32
STM32F334K6T6 LQFP-32_7x7x08P
STM32F334K8T6 LQFP-32_7x7x08P
STM32F334K8T7 LQFP-32(7x7)
STM32F334K8U6 UFQFPN-32(5x5)
STM32F334R6T6 LQFP-64_10x10x05P
STM32F334R8T6 LQFP-64_10x10x05P
STM32F334R8T7 LQFP-64(10x10)
STM32F334R8T7TR LQFP-64(10x10)
STM32F358VCT6 LQFP-100(14x14)
STM32F373C8T6 LQFP-48
STM32F373C8T6TR LQFP-48(7x7)
STM32F373CBT6 LQFP-48(7x7)
STM32F373CCT6 LQFP-48_7x7x05P
STM32F373CCT6TR LQFP-48(7x7)
STM32F373CCT7 LQFP-48(7x7)
STM32F373R8T6 LQFP-64(10x10)
STM32F373RBT6 LQFP-64_10x10x05P
STM32F373RCT6 LQFP-64_10x10x05P
STM32F373RCT6TR LQFP-64(10x10)
STM32F373V8H6 UFBGA-100(7x7)
STM32F373V8T6 LQFP-100
STM32F373VBH6 100-UFBGA
STM32F373VBT6 100-LQFP
STM32F373VBT7 LQFP-100(14x14)
STM32F373VCH6 100-UFBGA
STM32F373VCH7 UFBGA-100(7x7)
STM32F373VCT6 LQFP-100
ICGOODFIND Summary: In the ever-changing global semiconductor industry, the strategic layout of STMicroelectronics in the Chinese market is undoubtedly the focus of the industry. ICGOODFIND has always been closely following the industry dynamics. Through a series of measures such as cooperating with Chinese enterprises to produce 40nm MCU, STMicroelectronics focuses on both current cost control and revenue growth, and also looks to future market share expansion and technology exchange and integration, showing its unique strategic vision and firm confidence in the Chinese market. This "counter-trend" layout in a complex international situation not only paves a new path for its own development but also provides a new example for global semiconductor industry cooperation. We look forward to the smooth implementation of STMicroelectronics' strategic plan in the Chinese market to achieve mutual benefit and win-win results. At the same time, we hope that more enterprises can accurately grasp opportunities in the global market, actively promote industry innovation and collaborative development, and contribute to global technological progress.
ICGOODFIND recommends to everyone: The commonly used chip models of Hisilicon Semiconductor.#huawei#HiSilicon#semiconductor#technology#chips#mastercontrol#icgoodfind Huawei established the Huawei Integrated Circuit Design Center in 1991, and on this basis, HiSilicon Semiconductor Company was founded in 2004. Initially, HiSilicon focused on manufacturing chips for industrial applications, and later entered the fields of industrial control and mobile phone chips.
Huawei HiSilicon chips are a series of chips independently developed by HiSilicon Semiconductor Company under Huawei. ICgoodFind will also introduce some commonly sold chips in the industrial control industry other than the popular mobile phone Kirin chips.
Chip Features and Advantages:
Advanced Architecture Design: It features an advanced SoC architecture that can efficiently integrate multiple functional modules such as processors, communication modules, and graphics processing, achieving a balance between performance and power consumption.
Powerful Communication Capability: With the integrated self-developed communication baseband, it demonstrates excellent performance in communication, supporting multiple network standards and frequency bands, providing users with stable and fast network connections.
Excellent Artificial Intelligence Capability: It introduced artificial intelligence technology into chips relatively early. For example, the Kirin 970 is equipped with an artificial intelligence NPU chip, providing powerful computing power support for the intelligent applications of mobile phones.
Continuously Upgraded Process Technology: It has continuously evolved from the early 40nm process technology to adopt more advanced process technologies such as 16nm, 7nm, and even 5nm, improving the performance and energy efficiency of the chips.
Now, the commonly used models of HiSilicon chips in the industrial field are:
HI3531ARBCV100 Hisilicon
HI3519ARFCV100 Hisilicon
SC3105H Hisilicon
HI3531DRBCV100 Hisilicon
HI3516ARBCV300 Hisilicon
HI3519AV100 Hisilicon
HI3516DV300 Hisilicon
HI3516DRBCV300 Hisilicon
HI3516ERBCV300 Hisilicon
HI3516DV500 Hisilicon
HI3516EV300 Hisilicon
HI3516ERBCV100 Hisilicon
HI3520DRQCV300 Hisilicon
HI3556RFCV100 Hisilicon
HI3531DRBCV200 Hisilicon
HI3520DV400 Hisilicon
HI3521RFCV100 Hisilicon
HI1152GFCV100 Hisilicon
HI3536RBCV100 Hisilicon
HI3516ARBCV100 Hisilicon
HI3536DRBCV100 Hisilicon
HI3559ARFCV100 Hisilicon
HI3521 Hisilicon
HI3520DRBCV400 Hisilicon
HI3518ERBCV200 Hisilicon
HI3520DRQCV200 Hisilicon
HI3560ERQCV101 Hisilicon
HI3521DV100 Hisilicon
HI3798MRBCV20100000 Hisilicon
HI3536CRBCV100 Hisilicon
HI3556RBCV200 Hisilicon
HI3559AV100 Hisilicon
HI3518ERNCV300 Hisilicon
SD5117PRBCV100 Hisilicon
HI1151SGNCV208 Hisilicon
HI1151GNCV210 Hisilicon
HI3516ARFCV200 Hisilicon
HI3516ARBCV101 Hisilicon
HI3519RFCV101 Hisilicon
HI3559RBCV200 Hisilicon
HI3531RFCV100 Hisilicon
HI3516DRBCV100 Hisilicon
HI3516CRBCV500 Hisilicon
HI3521ARBCV100 Hisilicon
HI3798CRBCV201000 Hisilicon
HI3516CRBCV300 Hisilicon
HI3521DRBCV100 Hisilicon
HI3798MRBCV2010000 Hisilicon
SD5115TRBIV100 Hisilicon
HI3511RBCV110 Hisilicon
HI3559RFCV100 Hisilicon
HI3516ERNCV200 Hisilicon
HI3516CRBCV100 Hisilicon
HI3512 Hisilicon
HI3516A Hisilicon
HI3520RBCV100 Hisilicon
HI3535RBCV100 Hisilicon
HI3798CRBCV2010D0 Hisilicon
HI3798MRBCV201 Hisilicon
HI3516CRBCV200 Hisilicon
HI3130RNCV200 Hisilicon
HI3719CRBCV101000 Hisilicon
HI3796MRTCV20100000 Hisilicon
HI3535 Hisilicon
HI3515CRQCV100 Hisilicon
HI3251ARBCV510 Hisilicon
HI6361GFC Hisilicon
SD5116LRQIV100 Hisilicon
HI3798MRBCV101000 Hisilicon
HI3798MRQCV101000 Hisilicon
HI3532RFCV100 Hisilicon
HI3751ARBCV310HM00 Hisilicon
HI3521AV100 Hisilicon
HI3516CV500 Hisilicon
HI5001RNIV126 Hisilicon
HI3519RBCV100 Hisilicon
HI6403GWCV110 Hisilicon
HI3518ERBCV100 Hisilicon
HI3796MRBCV1010D0 Hisilicon
HI3798MRQCV1010D0 Hisilicon
HI3798MRBCV1010D0 Hisilicon
HI3796MRBCV101000 Hisilicon
HI3518ARBCV100 Hisilicon
HI3716MRBCV201000 Hisilicon
HI3518CRBCV100 Hisilicon
HI3881RNIV100 Hisilicon
HI3716MRQCV301000 Hisilicon
HI3515RBCV100 Hisilicon
HI3751ARBCV5510M00 Hisilicon
HI2115GBCV110 Hisilicon
HI3520ARFCV100 Hisilicon
HI6422GWCV100 Hisilicon
HI5620GNCV100 Hisilicon
HI3716MRQCV3010D0 Hisilicon
We hope that the content summarized by ICgoodFind will be helpful to the vast number of hardware engineers and friends engaged in HiSilicon solution development. In the highly competitive semiconductor arena, Huawei HiSilicon chips are undoubtedly a shining star.
ICgoodFind has been always committed to following and interpreting the dynamics of the chip industry, especially the development of Huawei HiSilicon chips. From its establishment to its in-depth cultivation in different fields, from mobile phone chips to industrial control chips, Huawei HiSilicon chips have demonstrated extraordinary innovative capabilities and indomitable development spirit. The features and advantages of its chips not only reflect the advanced nature of technology but also indicate the future development direction of chips.
We believe that Huawei HiSilicon chips will continue to play an important role in the industry, injecting a continuous stream of impetus into the development of the global science and technology industry. Meanwhile, ICgoodFind will, as always, provide customers with high-quality electronic component chips and professional services, and witness the progress of science and technology together with everyone.
On November 13th, news came that GigaDevice officially launched the high-performance GD32G5 series microcontroller unit (MCU) based on the Arm® Cortex® - M33 core. The product has excellent performance and can be widely applied to diverse scenarios such as digital power supplies, charging piles, etc. It comes in 7 packaging types with a total of 14 models. The application channels for sample chips and development boards have been opened, and mass production and supply will start in December.
The GD32G5 series MCU adopts a high-performance core with a main frequency of 216MHz. It is equipped with acceleration units such as DSP hardware accelerators, FPU, TMU, FAC, and FFT to improve processing efficiency and has excellent working performance. In terms of storage, it has reasonable designs including Flash, SRAM, and cache, which enhance the operating efficiency of the system.
This series of MCU is rich in peripheral resources, including ADCs, DACs, comparators, various timers, etc., which can meet the requirements of motor power control and timing. It has diverse and high-speed communication interfaces, as well as an HPDF digital filter, CLA, and Trigsel module. It supports a wide-temperature working range of - 40 - 105℃ and can work stably in scenarios such as optical modules and industrial power supplies.
The GD32G5 series MCU has powerful security functions, including security protection mechanisms, OTP storage space, ECC verification, hardware encryption and decryption modules, and TRNG. It supports the IEC 61508 SIL2 level functional safety standard and has a complete Safety Package to ensure safety.
The GD32 development ecosystem is growing. There are free development tools, and mainstream embedded tool manufacturers also support the development of GD32G5. Relevant manuals, documents, and tools have been uploaded to the website. The product combination includes various packaging models and supporting development boards, which are convenient for development and debugging.
Time passes quickly at ICGOODFIND. Looking back at this year's electronica China in Shanghai.
From July 8th to 10th, 2024, electronica China in Shanghai was successfully held, presenting a splendid event for the electronics industry.
This exhibition was of large scale, with as many as 1,671 exhibitors and an exhibition area of 100,000 square meters. In three days, it attracted 75,423 professional visitors. It was extremely lively, just like an exciting industrial symphony.At the booth of ICGOODFIND at the Munich Shanghai Electronics Show, there was a continuous flow of people. Endless visitors stopped one after another, eager to explore.
It also received the registration of thousands of electronics enthusiasts and electronics engineers, reaching cooperation consensus and achieving precise business docking with the platform.The exhibits and technologies of the exhibitors at this Munich exhibition closely followed the industry's key points and combined real-time hotspots, continuously innovating exhibition fields and forms. The entire exhibition site was bustling with people, fully demonstrating everyone's high enthusiasm for the exhibition and firm confidence in the future development of the electronics industry.Foreign users also visited our booth in succession.
Some foreign users said that due to inconvenient procurement in their countries, incomplete chip products, and high prices, resulting in excessive costs, production delays, and research and development suspensions. After coming to the Shanghai exhibition this time, they reaped a lot.The exhibits of this exhibition cover a wide range, covering the entire electronic industry chain, including everything from semiconductors, embedded systems, displays, sensor technologies, testing and measurement, electronic design (ED/EDA), passive components, connectors and switches, power supplies, PCBs, EMS to automotive electronics and testing.
ICGOODFIND also brought several spot chip products to participate in the exhibition. From high-performance processors to precision sensors, from energy-saving power management chips to high-speed data transmission chips, the variety coverage is comprehensive, and they are all currently popular products.
It is particularly worth mentioning that this year's exhibition focused on sorting out the annual context of the electronics industry. It listed application fields such as new energy vehicles, intelligent driving, energy storage, robots, wearables, intelligent buildings, edge intelligence, smart power supplies, and third-generation semiconductors as annual hot trends. And it carefully created an electronic technology theme exhibition area, building a professional exhibition platform spanning from product design to application implementation and across the upstream and downstream of the industry.
ICgoodFind recommends some of the latest and popular materials of Broadcom for Broadcom solution enthusiasts, hardware engineers, and circuit designers. Dear customers and friends, today let me introduce you to a giant in the semiconductor industry - Broadcom.
Broadcom is an extremely influential semiconductor company established in the United States in 1991. It has deep technical accumulation and excellent innovation ability in the semiconductor field and is one of the global technology leaders. Its products are widely used in key markets such as cloud, data centers, networks, broadband, wireless, storage, industrial and enterprise software.
In terms of products, there are several that are highly recommended:
Network communication chips:
WiFi chips: Broadcom's WiFi chip technology is in a leading position in the industry, providing stable and high-speed wireless network connections for many electronic devices. For example, their WiFi 7 chips have powerful performance and a wide range of high-speed connection options, which can meet the future demand for high-speed wireless networks.
Ethernet chips: In the field of Ethernet, Broadcom's chips are known for their high reliability and high performance. Whether it's enterprise-level network equipment or home network equipment, you can see the presence of Broadcom's Ethernet chips, providing a solid foundation for the network connection of equipment.
Storage chips: Broadcom also has excellent performance in the field of storage chips. Its storage chips have the characteristics of high capacity, high speed and high reliability, and are widely used in storage devices such as data centers and servers, which can meet the needs of large-scale data storage and high-speed data access.
Fiber optic transceiver chips: If you are concerned about the field of fiber optic communication, then Broadcom's fiber optic transceiver chips are definitely worth your attention. These chips have high performance and low power consumption characteristics and can achieve high-speed and stable fiber optic communication, providing high-quality fiber optic communication solutions for data centers, communication operators and others. SS15-0B00-00 Broadcom
BCM78900B0KFSBG Broadcom
BCM89811B1AWMLGT Broadcom
BCM88852A2KFLGG Broadcom
BCM56340A0KFSBLG Broadcom
BCM84758AKFSBG Broadcom
BCM54290B0KFBG Broadcom
ASMB-MTB0-0B3A2 Broadcom
BCM52311A1HH0H275S Broadcom
BCM65414B1IFSBG Broadcom
BCM53405A0KFSBG Broadcom
BCM4554IFSBG Broadcom
BCM53415A0KFSBG Broadcom
BCM84891LB0IFEBG Broadcom
BCM5241XA1KMLG Broadcom
BCM68628B0IFSBG Broadcom
SS24-0B00-02 Broadcom
BCM81181A1KRFBG Broadcom
BCM68626B0IFSBG Broadcom
BCM57412B1KFSBG Broadcom
BCM89811B1AWMLG Broadcom
BCM3390ZRKFSBG Broadcom
BCM7428ZZKFEB3G Broadcom
BCM53112MB1ILFBG Broadcom
SS05-0B00-00 Broadcom
SS02-0B00-00 Broadcom
BCM5481A2KFBG Broadcom
BCM56992B0KFLGG Broadcom
BCM56780A0KFSBG Broadcom
BCM57504B2KFSBG Broadcom
BCM16KB0CH0SX51RS Broadcom
BCM5482SEA2IFBG Broadcom
BCM6715XB0KRFBG Broadcom
BCM5482A2KFBG Broadcom
BCM53134MIFBG Broadcom
BCM53015A1IFEBLG Broadcom
BCM89564GB0BCFBG Broadcom
NLA122048H12600B1 Broadcom
BCM54213PEB1IMLG Broadcom
BCM68658A1IFSBG Broadcom
BCM84758AKFSBLG Broadcom
BCM84892B0IFSBG Broadcom
BCM68621B0IFSBG Broadcom
BCM54210EB1KMLG Broadcom
BCM63148VKFSBG Broadcom
BCM89530B1BPBGT Broadcom
BCM82780A3IFSBG Broadcom
BCM3390ZKFSBG Broadcom
SS26-0B00-02 Broadcom
BCM53115MIPBG Broadcom
BCM56334LB1IFSBLG Broadcom
BCM89830A0BWMLG Broadcom
BCM57416B1KFSBG Broadcom
BCM88770A1KFSBG Broadcom
BCM5482SHEA2KFBG Broadcom
BCM56980B0KFSBG Broadcom
BCM56160B0KFSBG Broadcom
SS29-0A00-03 Broadcom
BCM56970B0KFSBG Broadcom
BCM54182B0KQLEG Broadcom
PEX8714-AB80BIG Broadcom
BCM88790CB0KFSBG Broadcom
SS07-0B00-00 Broadcom
BCM53128IQLEG Broadcom
BCM88675CB0KFSBG Broadcom
BCM5482SA2IFBG Broadcom
BCM56841A4KFRBLG Broadcom
BCM5228FA4IPFG Broadcom
BCM87840A1KEFBG Broadcom
SI03-0B00-00 Broadcom
BCM89883B1BFBG Broadcom
BCM59121B0KMLG Broadcom
BCM5482SHA2IFBG Broadcom
BCM6715B0KFFBG Broadcom
BCM54210EB1IMLG Broadcom
SS06-0B00-00 Broadcom
BCM53115SIPBG Broadcom
BCM89883B1BFBGT Broadcom
BCM54991LB0IFEBG Broadcom
BCM5325EIQMG Broadcom
BCM56770A0KFSBG Broadcom
BCM56990B0KFLGG Broadcom
ASMB-BTE1-0B332 Broadcom
BCM56640B0IFSBLG Broadcom
BCM53312SB0KPBG Broadcom
BCM5482A2IFBG Broadcom
BCM56870A0IFSBG Broadcom
NLP1320-12CB2F Broadcom
BCM56873A0KFSBG Broadcom
BCM53346A0KFSBLG Broadcom
BCM59103BKMLG Broadcom
BCM88360A0IFSBLG Broadcom
BCM56260B0IFSBG Broadcom
BCM56850A2KFSBLG Broadcom
BCM957416N4160C Broadcom
SX03-0B00-00 Broadcom
SS04-0B00-00 Broadcom
BCM2837RIFBG Broadcom
BCM54210SB0KMLG Broadcom
BCM54640B0IFBG Broadcom
BCM81381A1KFSBG Broadcom
BCM89881B1BFBG Broadcom
BCM6756A1KFEBG Broadcom
BCM54680B0IFBG Broadcom
BCM53283MIPBG Broadcom
BCM56870A0KFSBG Broadcom
BCM5328MA1IQMG Broadcom
BCM53334A0IFSBLG Broadcom
BCM87580A0KFEBG Broadcom
BCM5248XA4KFB Broadcom
SS29-0A00-02 Broadcom
HCMS-2353 Broadcom
BCM56450B1IFSBG Broadcom
BCM54294B0IFBG Broadcom
BCM5222KQMG Broadcom
SS22-0B00-02 Broadcom
BCM43694B1KRFBG Broadcom
BCM54810C0KMLG Broadcom
BCM88682CA1KFSBG Broadcom
BCM56854A2IFSBLG Broadcom
BCM54991ELB0KFEBG Broadcom
BCM89551B1BFBGT Broadcom
BCM53343A0IFSBLG Broadcom
NLP1042-1G19C-W-RC03F Broadcom
HSMC-A431-X90M1 Broadcom
BCM84324BKFSBLG Broadcom
BCM49408A0KFEBG Broadcom
BCM54220SB0KFBG Broadcom
BCM63138UKFSBG Broadcom
BCM57414B1KFSBG Broadcom
BCM4366EKMMLW1G Broadcom
BCM3466KMLB0T Broadcom
BCM43684B1KRFBG Broadcom
BCM85110IFSBG Broadcom
BCM54219SB0IMLG Broadcom
BCM82792BKFSBG Broadcom
BCM53314SB0KPBG Broadcom
BCM87800A0KEFBG Broadcom
BCM88470CB0KFSBG Broadcom
B50210SB0KMLG Broadcom
BCM56151A0KFSBLG Broadcom
BCM84891LB0KFEBG Broadcom
BCM56457B1IFSBG Broadcom
BCM56320B1KFSBG Broadcom
BCM89230B1BCFBG Broadcom
B50292B0KQLEG Broadcom
BCM56302B1IEBG Broadcom
B50212EB1IMLG Broadcom
BCM53312SB0IPBG Broadcom
BCM11199KFBG Broadcom
BCM53101MIMLG Broadcom
B50285C1IFBG Broadcom
BCM82756AKFSBG Broadcom
ASMB-MTB1-0B3A2 Broadcom
BCM6710A1KFFBG Broadcom
BCM88270CA1IFSBG Broadcom
BCM3390SKFSBG Broadcom
BCM53162XMB1ILFBG Broadcom
BCM8129DIFB Broadcom
BCM82780FA3KFSBG Broadcom
BCM43143KMLGT Broadcom
BCM8152CIFB Broadcom
BCM5221A4KPTGT Broadcom
BCM56770A0IFSBG Broadcom
BCM56370A2KFSBG Broadcom
BCM56342A0KFSBLG Broadcom
BCM53134OKFBG Broadcom
BCM53343A0KFSBG Broadcom
BCM56768B0KFSBG Broadcom
BCM68901IMLG Broadcom
BCM3432KMLG Broadcom
BCM56170B0KFSBG Broadcom
ACHS-7121-000E Broadcom
BCM4708C0KFEBG Broadcom
NLP1042-19CC3F-W Broadcom
BCM49508B1IFSBG Broadcom
AFBR-S50LV85D Broadcom
BCM957412A4120AC Broadcom
BCM84894B0IFSBG Broadcom
B50140B0KFBG Broadcom
BCM53344A0KFSBG Broadcom
BCM63136SVKFSBG Broadcom
BCM5720A0KFBG Broadcom
BCM82780A3KFSBG Broadcom
BCM89530B1BPBG Broadcom
BCM56465B0KFSBG Broadcom
BCM56062A0KFSBG Broadcom
BCM65936A0IFSBG Broadcom
BCM95720A2003AC Broadcom
BCM84754A1KFSBLG Broadcom
BCM63158B1UKFSBG Broadcom
BCM89501BBQLEG Broadcom
BCM54210EB1KMLGT Broadcom
BCM84881B0KFEBG Broadcom
BCM84856RB1KFEBG Broadcom
BCM5321MKPBG Broadcom
BCM56820B0KFSBLG Broadcom
BCM56860A1KFSBG Broadcom
BCM56760B0IFSBG Broadcom
In short, Broadcom has become a leader in the semiconductor industry with its strong technical strength and rich product line. Whether you are engaged in network communication, data storage or other related fields, Broadcom's products can provide you with high-quality solutions. At ICgoodFind, we offer you a rich selection of Broadcom products. Welcome to purchase.
Eric Guo
2025 If you have used these chips, please contact us at icgoodfind. They are brand new and original. LTM4622IY#PBF
ADR02ARZ-REEL7
MAX1031BEEG+T
MAX823REUK+T
MAX3082ECSA+T
MPXV7002DP
TJA1145T/FDJ
SPC5744PFK1AMLQ9
JN5169/001Z
SC33771CTA1MAE
S912ZVML12AWKHR
TJA1051T/3/1J
LPC804M101JHI33Y
MCZ33903DP5EKR2
MC9S08AC60CFGER
PCF7936AA/3851/C/6
TJA1028T/5V0/20/1
FS32K116LFT0MLFT
VNHD7012AYTR
ST25R3916-AQET
STM32G071C8U6TR
STM32F030CCT6
ST25R3916-AQWT
E-L9826TR
SS24-0B00-02
MP3431GL-Z
LTM4615IV#PBF
IHW20N135R5
STM32F071CBT6TR
98DX3236A1-BTD4C000
CY7C65642-28LTXC
AD688BQ
ADL5562ACPZ-R7
AD2427WCCSZ-RL
TJA1055T/1J
W25Q256JVEIQ
ADG5412BRUZ
DS1302ZN+T&R
ATSAME51J18A-AU
CXDB6CCDM-MA-M
IR3557MTRPBF
ADL5375-05ACPZ-R7
AD822ARZ
BQ25120AYFP
IMX678-AAQR1-C
LPC2292FBD144/01,5
PIC16F886-I/SS
ATMEGA88PA-AU
#Electronics #ADI #MICRON #MICROCHIP #XILINX #TI #STM #NXP #INFINEON #CHIPS #ICGOODFIND
2 months ago | [YT] | 2
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Eric Guo
Automotive chips supplier onsemi has in-depth cooperation with Japan's DENSO in the field of automotive electronics. #Automotiveelectronics #chipssupplier #onsemi #DENSO #icgoodfind #adas
On December 17th, onsemi (with the NASDAQ stock symbol: ON), an American automotive chip supplier, and DENSO CORPORATION (hereinafter referred to as "Denso"), an automotive electronics supplier (tier-one), announced the strengthening of their long-term cooperative relationship in the technologies of autonomous driving (AD) and advanced driver assistance systems (ADAS).
For more than ten years, onsemi has been providing Denso with the latest intelligent automotive sensors to enhance the performance of ADAS and autonomous driving. These semiconductors are becoming increasingly important in improving vehicle intelligence, including connectivity, and will contribute to reducing traffic casualties.
"Denso hopes to cooperate more closely with us, which shows their confidence in onsemi's innovation ability, professional knowledge in the automotive technology field accumulated over decades, and supply resilience," said Hassane El-Khoury, President and CEO of onsemi.
"As the world's second-largest automotive system and parts supplier, Denso relies on a powerful supply chain to ensure the reliable supply of key raw materials such as semiconductors, so as to continuously serve customers with cutting-edge and reliable products," said Shinnosuke Hayashi, President of Denso. "Therefore, it is crucial to cooperate closely with industry leaders like onsemi. Over the years, onsemi has been using intelligent sensing technology to improve vehicle safety and autonomy and provides the supply guarantee we expect."
As a symbol of the cooperation between the two parties, Denso plans to acquire shares of onsemi in the open market to further consolidate the long-term cooperative relationship.
About Denso
Denso is headquartered in Kariya City, Japan. It is a leading automotive supplier worth $47.2 billion, developing advanced technologies and components applicable to almost all current vehicle models. With manufacturing as the core, Denso has invested in approximately 180 production facilities around the world, providing promising career opportunities and producing cutting-edge electrification, powertrain, thermal management, and automotive electronics products that are changing the world. During the fiscal year ended March 31, 2024, Denso's R&D expenses accounted for approximately 7.7% of its global consolidated sales.
About onsemi
onsemi (with the NASDAQ stock symbol: ON) is committed to driving disruptive innovation and creating a better future. The company focuses on the major trends in the automotive and industrial end markets, accelerating the transformative innovation in segments such as the electronization of automotive functions, automotive safety, sustainable power grids, industrial automation, and 5G and cloud infrastructure. onsemi provides a highly differentiated portfolio of innovative products as well as intelligent power and intelligent sensing technologies to solve the world's most complex challenges and lead the creation of a safer, cleaner, and smarter world. onsemi is listed among the Fortune 500 in the United States and is also included in the NASDAQ 100 Index and the S&P 500 Index.
4 months ago (edited) | [YT] | 2
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Eric Guo
STMicroelectronics announced that the 40nm MCU will be produced by Huahong Group, the second-largest wafer foundry in China. #STMicroelectronics #mcu #chips #STM32 #ST #SiC #AutomotiveElectronics #icgoodfind
On November 21st, news came that STMicroelectronics, a major European chipmaker, held an Investor Day event in Paris, France on Wednesday local time. It announced that it would cooperate with the second-largest wafer foundry in China to produce 40nm-node microcontrollers (MCU) in China to support the achievement of its medium- and long-term revenue goals.
STMicroelectronics, through the implementation of a manufacturing restructuring plan and a cost base adjustment plan, is expected to save up to several million dollars compared to the current cost by 2027. The expected revenue for 2027 - 2028 is about 180 billion US dollars, and the operating profit margin is between 22% and 24%.
To support the achievement of this goal, Jean-Marc Chery, the CEO of STMicroelectronics, announced on Wednesday local time that he would cooperate with Huahong Group, the second-largest wafer foundry in China, and planned to produce 40nm MCU in China by the end of 2025. He believed that local manufacturing in China was crucial for its competitive position.
Fabio Gualandris, the manufacturing director of STMicroelectronics, said that other reasons for manufacturing in China included the cost-effectiveness of the local supply chain, compatibility issues, and the risk of government restrictions. In addition, producing chips anywhere else meant missing out on the rapid electric vehicle development cycle in China.
"They are moving faster," he said. "If you are not here, you cannot respond in a timely manner."
When Jean-Marc Chery made the above remarks, major countries and regions around the world such as the United States, Europe, China, and Japan were all actively promoting more chip manufacturing locally, and many chip companies had been expanding in Singapore and Malaysia to serve the Asian market.
However, STMicroelectronics is the largest manufacturer of energy-saving silicon carbide (SiC) chips for electric vehicles, and its customers include Tesla and Geely. The company said that the Chinese market, as the largest and most innovative market for electric vehicles, was an indispensable market and it was impossible to fully compete from the outside.
Jean-Marc Chery said, "If we cede the market share in China to another company working in the industrial or the automotive field, that is, a Chinese enterprise, they will dominate their own market. And their domestic market is so huge that it will be an excellent platform for them to compete in other countries."
According to STMicroelectronics' plan, the plan to manufacture its STM32 series products in China will help STMicroelectronics expand its customer base by 50% in the next five years.
He added that STMicroelectronics was adopting the best practices and technologies learned in the Chinese market and applying them to the Western market. "The story of the missionary is over," he said.
Before Jean-Marc Chery made the above remarks to reporters in Paris, the company had been hit hard by the downturn in the industrial chip market.
ICGOODFIND recommends a complete list of commonly used chips of STMicroelectronics.
STM32F302C8T6 LQFP-48_7x7x05P
STM32F302CBT6 LQFP-48_7x7x05P
STM32F302CBT6TR LQFP-48(7x7)
STM32F302CCT6 48-LQFP
STM32F302CCT7 LQFP-48(7x7)
STM32F302K6U6 32-UFQFN 裸露焊盘
STM32F302K8U6 UFQFPN-32
STM32F302K8U6TR UFQFN-32(5x5)
STM32F302R6T6 LQFP-64(10x10)
STM32F302R8T6 LQFP-64
STM32F302RBT6 LQFP-64
STM32F302RBT6TR LQFP-64(10x10)
STM32F302RBT7 LQFP-64(10x10)
STM32F302RBT7TR LQFP-64(10x10)
STM32F302RCT6 LQFP-64
STM32F302RCT6TR
STM32F302RCT7TR
STM32F302RDT6 LQFP-64(10x10)
STM32F302RDT6TR
STM32F302RET6 LQFP-64(10x10)
STM32F302RET6TR LQFP-64(10x10)
STM32F302VBT6 LQFP-100(14x14)
STM32F302VCT6 LQFP-100(14x14)
STM32F302VCT7 LQFP-100(14x14)
STM32F302VDH6 UFBGA-100(7x7)
STM32F302VDT6 100-LQFP
STM32F302VET6 LQFP-100(14x14)
STM32F302ZET6 LQFP-144(20x20)
STM32F303C6T6 LQFP-48(7x7)
STM32F303C8T6 LQFP-48_7x7x05P
STM32F303CBT6 LQFP-48_7x7x05P
STM32F303CBT6TR LQFP-48(7x7)
STM32F303CBT7 LQFP-48(7x7)
STM32F303CCT6 LQFP-48_7x7x05P
STM32F303CCT6TR LQFP-48(7x7)
STM32F303CCT7 48-LQFP
STM32F303K6T6 LQFP-32(7x7)
STM32F303K8T6 LQFP-32_7x7x08P
STM32F303R6T6 LQFP-64(10x10)
STM32F303R8T6 LQFP-64_10x10x05P
STM32F303RBT6 LQFP-64_10x10x05P
STM32F303RBT6TR LQFP-64(10x10)
STM32F303RBT7 64-LQFP
STM32F303RBT7TR LQFP-64(10x10)
STM32F303RCT6 LQFP-64_10x10x05P
STM32F303RCT6TR LQFP-64
STM32F303RCT7 LQFP-64
STM32F303RDT6 LQFP-64(10x10)
STM32F303RDT7 QFP64
STM32F303RET6 LQFP-64_10x10x05P
STM32F303RET6TR LQFP-64(10x10)
STM32F303RET7 LQFP-64
STM32F303VBT6 LQFP-100(14x14)
STM32F303VBT6TR LQFP-100(14x14)
STM32F303VCT6 LQFP-100_14x14x05P
STM32F303VCT6TR LQFP-100(14x14)
STM32F303VCT7 LQFP-100_14x14x05P
STM32F303VDT6 LQFP-100(14x14)
STM32F303VEH6 UFBGA-100(7x7)
STM32F303VET6 LQFP-100
STM32F303VET6TR LQFP-100(14x14)
STM32F303VET7 LQFP-100(14x14)
STM32F303ZDT6 LQFP-144(20x20)
STM32F303ZET6 LQFP-144_20x20x05P
STM32F303ZET7 LQFP-144(20x20)
STM32F334C6T6 LQFP-48
STM32F334C6T6TR
STM32F334C8T6 LQFP-48_7x7x05P
STM32F334C8T7 LQFP-48(7x7)
STM32F334C8T7TR LQFP-48(7x7)
STM32F334K4T6 LQFP-32
STM32F334K6T6 LQFP-32_7x7x08P
STM32F334K8T6 LQFP-32_7x7x08P
STM32F334K8T7 LQFP-32(7x7)
STM32F334K8U6 UFQFPN-32(5x5)
STM32F334R6T6 LQFP-64_10x10x05P
STM32F334R8T6 LQFP-64_10x10x05P
STM32F334R8T7 LQFP-64(10x10)
STM32F334R8T7TR LQFP-64(10x10)
STM32F358VCT6 LQFP-100(14x14)
STM32F373C8T6 LQFP-48
STM32F373C8T6TR LQFP-48(7x7)
STM32F373CBT6 LQFP-48(7x7)
STM32F373CCT6 LQFP-48_7x7x05P
STM32F373CCT6TR LQFP-48(7x7)
STM32F373CCT7 LQFP-48(7x7)
STM32F373R8T6 LQFP-64(10x10)
STM32F373RBT6 LQFP-64_10x10x05P
STM32F373RCT6 LQFP-64_10x10x05P
STM32F373RCT6TR LQFP-64(10x10)
STM32F373V8H6 UFBGA-100(7x7)
STM32F373V8T6 LQFP-100
STM32F373VBH6 100-UFBGA
STM32F373VBT6 100-LQFP
STM32F373VBT7 LQFP-100(14x14)
STM32F373VCH6 100-UFBGA
STM32F373VCH7 UFBGA-100(7x7)
STM32F373VCT6 LQFP-100
ICGOODFIND Summary: In the ever-changing global semiconductor industry, the strategic layout of STMicroelectronics in the Chinese market is undoubtedly the focus of the industry. ICGOODFIND has always been closely following the industry dynamics. Through a series of measures such as cooperating with Chinese enterprises to produce 40nm MCU, STMicroelectronics focuses on both current cost control and revenue growth, and also looks to future market share expansion and technology exchange and integration, showing its unique strategic vision and firm confidence in the Chinese market. This "counter-trend" layout in a complex international situation not only paves a new path for its own development but also provides a new example for global semiconductor industry cooperation. We look forward to the smooth implementation of STMicroelectronics' strategic plan in the Chinese market to achieve mutual benefit and win-win results. At the same time, we hope that more enterprises can accurately grasp opportunities in the global market, actively promote industry innovation and collaborative development, and contribute to global technological progress.
5 months ago | [YT] | 2
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Eric Guo
ICGOODFIND recommends to everyone: The commonly used chip models of Hisilicon Semiconductor.#huawei #HiSilicon #semiconductor #technology #chips #mastercontrol #icgoodfind
Huawei established the Huawei Integrated Circuit Design Center in 1991, and on this basis, HiSilicon Semiconductor Company was founded in 2004. Initially, HiSilicon focused on manufacturing chips for industrial applications, and later entered the fields of industrial control and mobile phone chips.
Huawei HiSilicon chips are a series of chips independently developed by HiSilicon Semiconductor Company under Huawei. ICgoodFind will also introduce some commonly sold chips in the industrial control industry other than the popular mobile phone Kirin chips.
Chip Features and Advantages:
Advanced Architecture Design: It features an advanced SoC architecture that can efficiently integrate multiple functional modules such as processors, communication modules, and graphics processing, achieving a balance between performance and power consumption.
Powerful Communication Capability: With the integrated self-developed communication baseband, it demonstrates excellent performance in communication, supporting multiple network standards and frequency bands, providing users with stable and fast network connections.
Excellent Artificial Intelligence Capability: It introduced artificial intelligence technology into chips relatively early. For example, the Kirin 970 is equipped with an artificial intelligence NPU chip, providing powerful computing power support for the intelligent applications of mobile phones.
Continuously Upgraded Process Technology: It has continuously evolved from the early 40nm process technology to adopt more advanced process technologies such as 16nm, 7nm, and even 5nm, improving the performance and energy efficiency of the chips.
Now, the commonly used models of HiSilicon chips in the industrial field are:
HI3531ARBCV100 Hisilicon
HI3519ARFCV100 Hisilicon
SC3105H Hisilicon
HI3531DRBCV100 Hisilicon
HI3516ARBCV300 Hisilicon
HI3519AV100 Hisilicon
HI3516DV300 Hisilicon
HI3516DRBCV300 Hisilicon
HI3516ERBCV300 Hisilicon
HI3516DV500 Hisilicon
HI3516EV300 Hisilicon
HI3516ERBCV100 Hisilicon
HI3520DRQCV300 Hisilicon
HI3556RFCV100 Hisilicon
HI3531DRBCV200 Hisilicon
HI3520DV400 Hisilicon
HI3521RFCV100 Hisilicon
HI1152GFCV100 Hisilicon
HI3536RBCV100 Hisilicon
HI3516ARBCV100 Hisilicon
HI3536DRBCV100 Hisilicon
HI3559ARFCV100 Hisilicon
HI3521 Hisilicon
HI3520DRBCV400 Hisilicon
HI3518ERBCV200 Hisilicon
HI3520DRQCV200 Hisilicon
HI3560ERQCV101 Hisilicon
HI3521DV100 Hisilicon
HI3798MRBCV20100000 Hisilicon
HI3536CRBCV100 Hisilicon
HI3556RBCV200 Hisilicon
HI3559AV100 Hisilicon
HI3518ERNCV300 Hisilicon
SD5117PRBCV100 Hisilicon
HI1151SGNCV208 Hisilicon
HI1151GNCV210 Hisilicon
HI3516ARFCV200 Hisilicon
HI3516ARBCV101 Hisilicon
HI3519RFCV101 Hisilicon
HI3559RBCV200 Hisilicon
HI3531RFCV100 Hisilicon
HI3516DRBCV100 Hisilicon
HI3516CRBCV500 Hisilicon
HI3521ARBCV100 Hisilicon
HI3798CRBCV201000 Hisilicon
HI3516CRBCV300 Hisilicon
HI3521DRBCV100 Hisilicon
HI3798MRBCV2010000 Hisilicon
SD5115TRBIV100 Hisilicon
HI3511RBCV110 Hisilicon
HI3559RFCV100 Hisilicon
HI3516ERNCV200 Hisilicon
HI3516CRBCV100 Hisilicon
HI3512 Hisilicon
HI3516A Hisilicon
HI3520RBCV100 Hisilicon
HI3535RBCV100 Hisilicon
HI3798CRBCV2010D0 Hisilicon
HI3798MRBCV201 Hisilicon
HI3516CRBCV200 Hisilicon
HI3130RNCV200 Hisilicon
HI3719CRBCV101000 Hisilicon
HI3796MRTCV20100000 Hisilicon
HI3535 Hisilicon
HI3515CRQCV100 Hisilicon
HI3251ARBCV510 Hisilicon
HI6361GFC Hisilicon
SD5116LRQIV100 Hisilicon
HI3798MRBCV101000 Hisilicon
HI3798MRQCV101000 Hisilicon
HI3532RFCV100 Hisilicon
HI3751ARBCV310HM00 Hisilicon
HI3521AV100 Hisilicon
HI3516CV500 Hisilicon
HI5001RNIV126 Hisilicon
HI3519RBCV100 Hisilicon
HI6403GWCV110 Hisilicon
HI3518ERBCV100 Hisilicon
HI3796MRBCV1010D0 Hisilicon
HI3798MRQCV1010D0 Hisilicon
HI3798MRBCV1010D0 Hisilicon
HI3796MRBCV101000 Hisilicon
HI3518ARBCV100 Hisilicon
HI3716MRBCV201000 Hisilicon
HI3518CRBCV100 Hisilicon
HI3881RNIV100 Hisilicon
HI3716MRQCV301000 Hisilicon
HI3515RBCV100 Hisilicon
HI3751ARBCV5510M00 Hisilicon
HI2115GBCV110 Hisilicon
HI3520ARFCV100 Hisilicon
HI6422GWCV100 Hisilicon
HI5620GNCV100 Hisilicon
HI3716MRQCV3010D0 Hisilicon
We hope that the content summarized by ICgoodFind will be helpful to the vast number of hardware engineers and friends engaged in HiSilicon solution development. In the highly competitive semiconductor arena, Huawei HiSilicon chips are undoubtedly a shining star.
ICgoodFind has been always committed to following and interpreting the dynamics of the chip industry, especially the development of Huawei HiSilicon chips. From its establishment to its in-depth cultivation in different fields, from mobile phone chips to industrial control chips, Huawei HiSilicon chips have demonstrated extraordinary innovative capabilities and indomitable development spirit. The features and advantages of its chips not only reflect the advanced nature of technology but also indicate the future development direction of chips.
We believe that Huawei HiSilicon chips will continue to play an important role in the industry, injecting a continuous stream of impetus into the development of the global science and technology industry. Meanwhile, ICgoodFind will, as always, provide customers with high-quality electronic component chips and professional services, and witness the progress of science and technology together with everyone.
5 months ago | [YT] | 2
View 0 replies
Eric Guo
GigaDevice has launched a brand - new high - performance GD32G5 series MCU based on the Arm Cortex - M33 core.#Gigadevice #GD32G #MCU #ARM #Flash #SRAM #DSP #chips #icgoodfind
On November 13th, news came that GigaDevice officially launched the high-performance GD32G5 series microcontroller unit (MCU) based on the Arm® Cortex® - M33 core. The product has excellent performance and can be widely applied to diverse scenarios such as digital power supplies, charging piles, etc. It comes in 7 packaging types with a total of 14 models. The application channels for sample chips and development boards have been opened, and mass production and supply will start in December.
The GD32G5 series MCU adopts a high-performance core with a main frequency of 216MHz. It is equipped with acceleration units such as DSP hardware accelerators, FPU, TMU, FAC, and FFT to improve processing efficiency and has excellent working performance. In terms of storage, it has reasonable designs including Flash, SRAM, and cache, which enhance the operating efficiency of the system.
This series of MCU is rich in peripheral resources, including ADCs, DACs, comparators, various timers, etc., which can meet the requirements of motor power control and timing. It has diverse and high-speed communication interfaces, as well as an HPDF digital filter, CLA, and Trigsel module. It supports a wide-temperature working range of - 40 - 105℃ and can work stably in scenarios such as optical modules and industrial power supplies.
The GD32G5 series MCU has powerful security functions, including security protection mechanisms, OTP storage space, ECC verification, hardware encryption and decryption modules, and TRNG. It supports the IEC 61508 SIL2 level functional safety standard and has a complete Safety Package to ensure safety.
The GD32 development ecosystem is growing. There are free development tools, and mainstream embedded tool manufacturers also support the development of GD32G5. Relevant manuals, documents, and tools have been uploaded to the website. The product combination includes various packaging models and supporting development boards, which are convenient for development and debugging.
5 months ago | [YT] | 2
View 0 replies
Eric Guo
Time passes quickly at ICGOODFIND. Looking back at this year's electronica China in Shanghai.
From July 8th to 10th, 2024, electronica China in Shanghai was successfully held, presenting a splendid event for the electronics industry.
This exhibition was of large scale, with as many as 1,671 exhibitors and an exhibition area of 100,000 square meters. In three days, it attracted 75,423 professional visitors. It was extremely lively, just like an exciting industrial symphony.At the booth of ICGOODFIND at the Munich Shanghai Electronics Show, there was a continuous flow of people. Endless visitors stopped one after another, eager to explore.
It also received the registration of thousands of electronics enthusiasts and electronics engineers, reaching cooperation consensus and achieving precise business docking with the platform.The exhibits and technologies of the exhibitors at this Munich exhibition closely followed the industry's key points and combined real-time hotspots, continuously innovating exhibition fields and forms. The entire exhibition site was bustling with people, fully demonstrating everyone's high enthusiasm for the exhibition and firm confidence in the future development of the electronics industry.Foreign users also visited our booth in succession.
Some foreign users said that due to inconvenient procurement in their countries, incomplete chip products, and high prices, resulting in excessive costs, production delays, and research and development suspensions. After coming to the Shanghai exhibition this time, they reaped a lot.The exhibits of this exhibition cover a wide range, covering the entire electronic industry chain, including everything from semiconductors, embedded systems, displays, sensor technologies, testing and measurement, electronic design (ED/EDA), passive components, connectors and switches, power supplies, PCBs, EMS to automotive electronics and testing.
ICGOODFIND also brought several spot chip products to participate in the exhibition. From high-performance processors to precision sensors, from energy-saving power management chips to high-speed data transmission chips, the variety coverage is comprehensive, and they are all currently popular products.
It is particularly worth mentioning that this year's exhibition focused on sorting out the annual context of the electronics industry. It listed application fields such as new energy vehicles, intelligent driving, energy storage, robots, wearables, intelligent buildings, edge intelligence, smart power supplies, and third-generation semiconductors as annual hot trends. And it carefully created an electronic technology theme exhibition area, building a professional exhibition platform spanning from product design to application implementation and across the upstream and downstream of the industry.
6 months ago | [YT] | 3
View 0 replies
Eric Guo
ICgoodFind recommends some of the latest and popular materials of Broadcom for Broadcom solution enthusiasts, hardware engineers, and circuit designers.
Dear customers and friends, today let me introduce you to a giant in the semiconductor industry - Broadcom.
Broadcom is an extremely influential semiconductor company established in the United States in 1991. It has deep technical accumulation and excellent innovation ability in the semiconductor field and is one of the global technology leaders. Its products are widely used in key markets such as cloud, data centers, networks, broadband, wireless, storage, industrial and enterprise software.
In terms of products, there are several that are highly recommended:
Network communication chips:
WiFi chips: Broadcom's WiFi chip technology is in a leading position in the industry, providing stable and high-speed wireless network connections for many electronic devices. For example, their WiFi 7 chips have powerful performance and a wide range of high-speed connection options, which can meet the future demand for high-speed wireless networks.
Ethernet chips: In the field of Ethernet, Broadcom's chips are known for their high reliability and high performance. Whether it's enterprise-level network equipment or home network equipment, you can see the presence of Broadcom's Ethernet chips, providing a solid foundation for the network connection of equipment.
Storage chips: Broadcom also has excellent performance in the field of storage chips. Its storage chips have the characteristics of high capacity, high speed and high reliability, and are widely used in storage devices such as data centers and servers, which can meet the needs of large-scale data storage and high-speed data access.
Fiber optic transceiver chips: If you are concerned about the field of fiber optic communication, then Broadcom's fiber optic transceiver chips are definitely worth your attention. These chips have high performance and low power consumption characteristics and can achieve high-speed and stable fiber optic communication, providing high-quality fiber optic communication solutions for data centers, communication operators and others.
SS15-0B00-00 Broadcom
BCM78900B0KFSBG Broadcom
BCM89811B1AWMLGT Broadcom
BCM88852A2KFLGG Broadcom
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In short, Broadcom has become a leader in the semiconductor industry with its strong technical strength and rich product line. Whether you are engaged in network communication, data storage or other related fields, Broadcom's products can provide you with high-quality solutions. At ICgoodFind, we offer you a rich selection of Broadcom products. Welcome to purchase.
6 months ago | [YT] | 2
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Eric Guo
The world's leading semiconductor chip companies, including semiconductor chip equipment, materials, manufacturing, agents and other major brands.
7 months ago | [YT] | 2
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